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Materials

Choose from a wide range of high-quality powders that deliver superior performance and durability.


Copper


Material characteristics

Superior yield strength, improved machinability.

Applications

Busbars, cable clamps, electrical connectors, heatsinks, moulds, and anti-microbial coatings.

Microstructure Pure Copper
SPEE3D as heat treated microstructure

Composition
Element Percentage
Cu, min 99.70%
Oxygen, max 0.15%
Material properties
CAST (reference) SPEE3D PRINTED
Standard CC040A spec3 Pure Copper as heat treated and annealed4
Yield Strength (MPa) ASTM E82 40 125 (min)
Ultimate Tensile Strength (MPa) ASTM E82 150 145 (min)
Elongation at break (min %) ASTM E82 25 6 (min)
Hardness (min HV5) ASTM E18 40 60 (typ), 130 (typ, as printed)
Electrical Conductivity (%IACS) ISO15548-1 86-98 96.8 (typ)
Thermal Conductivity W/m.K 372 369(5) (typ)
  1. Properties shown reflect beta processing parameters. Properties were obtained for annealing loads between 0.2 kg and 3 kg.
  2. Specimens tested according to ASTM E8.
  3. From standard EN 1982:2008.
  4. Material heat treated and annealed according to SPEE3D SOP standard operating procedure.
  5. Value calculated from electrical conductivity.

Listed designations are for reference purposes only. Composition and mechanical properties may vary. End-use material performance is impacted (+/-) by certain factors including but not limited to part geometry and design, application and evaluation conditions.